SEMI106 Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer Packaging Lang-Japanese 6，SEMI E49

6，SEMI E49

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SEMI E117-1104 (Reapproved 0816)

SEMI106 Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer Packaging Lang-Japanese 6，SEMI E49Course Description This course will help you learn why and how new packaging paradigms like chiplets and dielets impact the world of flexible hybrid electronics (FHE) from one of the industry's foremost experts, Dr. Subramanian Lyer of UCLA. This course explores how these packages pack such a punch, enabling advanced performance in a much smaller and more flexible footprint. The area of Flexible Hybrid Electronics (FHE) has also developed and is