MF065700 - SEMI MF657 - Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning Revision:SEMI MF657-0707E (Withdrawn 0914) - Withdrawn This Specification is intended to

This Specification is intended to provide a marking symbology that can be used to mark glass flat panel display (FPD) substrates within the fixed quality area (FQA) of the edge exclusion area of the substrate

The results should be reported as within specification (below a certain value) or not in specification only (SEMI C1)

and coated transparent surfaces that may have been purposely modified (textured) to achieve desired reflective and/or transmissive properties

1-0706 (technical revision)

and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers

MF065700 - SEMI MF657 - Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning Revision:SEMI MF657-0707E (Withdrawn 0914) - Withdrawn This Specification is intended toThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on April 25, 2007. It was available at www. semi. org in June 2007. Originally published by ASTM International as ASTM F 657 80; previously published July 2005. Warp and thickness variation of silicon wafers can significantly affect the yield of semiconductor device processing. Knowledge