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G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded 1 ppm以内であることが分かっている。

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1 ppm以内であることが分かっている。

A brief description of the theory of this Test Method is given in Related Information 1

used to ship

The dynamic test method evaluates performance during component operation and provides an indication of the steady state particle contribution due to dynamic operating conditions

higher-level injection is often adopted

G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded 1 ppm以内であることが分かっている。global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.

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