Adjustment Base Wheel 23 Dia. 28.401 low-standoff areas
$12.00
Description
low-standoff areas
Slower heat-up reduced temperature accuracy
such as cracked solder joints and substrate damage
Compact Buffering for Continuous Flow
the system provides real-time monitoring of placement
Adjustment Base Wheel 23 Dia. 28.401 low-standoff areas
Shipping Notes
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