SEMI107 Printing, Curing, and Characterization Methods for Printable Conductors StdTpc-Package & Chip Carrier Tooling ranging from legacy systems to

ranging from legacy systems to the latest in electronic chip identification (ECID) and 2D code package marking

SEMI MF1763-0706 (technical revision)

SEMI C96-1121 (technical revision)

multicrystalline silicon and other type of crystalline silicon PV modules

SEMI E53 — Event Reporting

SEMI107 Printing, Curing, and Characterization Methods for Printable Conductors StdTpc-Package & Chip Carrier Tooling ranging from legacy systems toCourse Description This course covers all the basics of using printable conductors for additive manufacturing of circuits on polymer substrates. Students will learn about the different types of classes of conductive inks available and how to characterize their performance and cost. Students will also procure an overview of traditional and digital printing methods, drying curing sintering methods, and design and assembly differences compared to