P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdPbc-0220 This Guide can be used

This Guide can be used as a guide by semiconductor manufacturers and cleanroom facilities designers during the design of their facilities

production equipment including process and metrology equipment

SEMI E87-0301 (technical revision)

an automated approach to fabrication of suitable test structures using standard tools available in modern wafer fabs

The purpose of this standard is twofold: to enable applications software to be developed that can assume the existence of standard concepts

P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdPbc-0220 This Guide can be usedThis checklist was technically approved by the Global Micropatterning Committee and is the direct responsibility of the Japanese Micropatterning Committee. Current edition approved by the Japanese Regional Standards Committee on April 28, 2003. Initially available at www. semi. org June 2003; to be published July 2003. Originally published in 1996. NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain