MC889 High Speed Pick & Place Placement Heads:8 Heads Adjustable Design for Maximum Flexibility

Adjustable Design for Maximum Flexibility

Supports efficient workflow and inventory access

Ideal for large assemblies: suited for LED panels

precise control of wave height and solder volume through adjustable speed and acceleration

Lower evaporation: improved solution stability

MC889 High Speed Pick & Place Placement Heads:8 Heads Adjustable Design for Maximum FlexibilityHigh Throughput Placement with Multi Head Precision The MC889 is designed for high volume production, delivering placement speeds up to 20,000 CPH with configurations of 6, 8, or 10 placement heads. It maintains high accuracy of 30 m (3 Sigma) while handling components from 01005 up to 100 150 mm. Up to 20,000 CPH: high speed placement for large scale production 6, 8, or 10 heads: increased head count boosts throughput 30 m accuracy (3 Sigma): ensures