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Surface Preparation & Cleaning Conference (SPCC) 2026 StdPbc-0516 their specifications
$900.00
Description
their specifications
本仕様では,半導体および電子デバイスの製造に使用される円盤状100 mm高純度単結晶ゲルマニウムウェーハの基板に関する要求事項をカバーする。
1 — Specification for SOAP Implementation of Equipment Self Description
and precipitates/inclusions
SEMI D57-0310 (first published)
Surface Preparation & Cleaning Conference (SPCC) 2026 StdPbc-0516 their specifications
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