T02400 - SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications StdTpc-Electronic Data Interchange this Practice defines a wafer

this Practice defines a wafer coordinate system to facilitate the precise locating and reporting of points on the wafer surface

the form includes many items that are not currently included in the SEMI specifications

org in June 2015

robotics suppliers

one of the problems is to identify and eliminate the sources of mechanical defects such as thermo-elastic stress and cracks leading to the loss of wafer integrity and ultimate breakage of as-grown and processed Si cells

T02400 - SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications StdTpc-Electronic Data Interchange this Practice defines a waferThis Specification is intended to provide a marking symbology that can be used to mark glass carrier characteristics for panel level packaging (PLP). This Specification defines the geometric shape, size and content of a rectangular two dimensional (2D) code symbol for back surface marking of the glass carrier for use in PLP applications. Although this Specification does not specify the marking techniques that may be employed when complying with its