G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 organics contribution

organics contribution

This flange is to be mounted to the floor within the volume defined by the equipment loadport standards

and facilities managers who specify compatibility requirements for equipment and utility services

9% hydrofluoric acid used in the semiconductor industry

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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 organics contributionThis Standard defines the pull strength test method for wire bonding. Referenced SEMI Standards None.