G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title This Specification covers requirements for

This Specification covers requirements for all grades of dichlorosilane (SiH2Cl2) used in the semiconductor industry

NOTICE: This Document was completely rewritten in 2008

2-0316 (Reapproved 0124)

focusing on real world rather than algorithm development

the user estimates all biases and variances associated with the equipment being compared under the specified operating conditions and with respect to the process characteristic(s) of interest

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title This Specification covers requirements forThis document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.