Packaging of components for automatic handling - Introduction of a bulk blister pack for miniaturized components Ingestion-build-50790 data format for device embedded

data format for device embedded substrate

Enhancing customer satisfaction by: creating a customer-focused environment that’s open to feedback (including complaints)

Proprietary performance

4 Construction

BS 5502-80 is a standard that covers workshops

Packaging of components for automatic handling - Introduction of a bulk blister pack for miniaturized components Ingestion-build-50790 data format for device embedded1 Scope This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.