Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints Ingestion-build-115288 Values for additional space requirements

Values for additional space requirements are given in annex A

• Hydrogen-embrittlement-relief heat treatments

IEC 60034 (all parts)

BS EN 1992-3 is the third part of the BS EN 1992 multi-series that discusses the design of concrete structures

offers optimum efficiency and optimization throughout and cuts down on energy use

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints Ingestion-build-115288 Values for additional space requirementsDD IEC PAS 62137 3: 2009 describes the selection of an appropriate test method for reliability testing of solder joints. The test methods given are applicable to evaluate the strength of joints of a component mounted on printed wiring board, but not to test the mechanical strength of components themselves. The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range