GaP Wafer, Undoped (111) 10x10x0.5 mm, 2sp Pouch Cell It is used to connect

It is used to connect the coater for preventing wastewater from flowing into the pump

Sepecification: Apperance: White powder Viscosity: 200300mpa

we will forward your inquiry to the manufacturer

A cooling system is built in to avoid sample overheating or splashing water during cutting

made of 316 stainless steel with sealing O-ring

GaP Wafer, Undoped (111) 10x10x0.5 mm, 2sp Pouch Cell It is used to connectGaP single crystal wafer, Size: 10mm x 10 mm x 0. 5 mm, Doping: undoped, Conducting type: N type, Orientation: (111) Polished: Two sides Surface finish (RMS or Ra) : < 8A Typical Physical Properties Crystal Structure Cubic. a =5. 4505 Growth Method CZ (LEC) Density 4. 13 g cm3 Melt Point 1480 oC Thermal Expansion 5. 3 x10 6 oC Dopant S doped undoped Crystal growth axis <111> or <100> <100> or <111> Conducting Type N N Carrier Concentration 2 ~ 8 x1017