Silicon-on-Sapphire (11-02, R Plane ), 100mm Dia x 0.46mm,1sp, Film: 0.5 um thick Saws How to mount 86mm dicing

How to mount 86mm dicing blade

5" Diamond Particles Grit 280 mesh ( 40 microns) Note  If you try to cut non-ferrous metal or alloy

Puncture Strength :

Polished surface:   substrate surface is EPI polished via a special CMP procedure with Ra < 5 A

and wetting

Silicon-on-Sapphire (11-02, R Plane ), 100mm Dia x 0.46mm,1sp, Film: 0.5 um thick Saws How to mount 86mm dicingSilicon on sapphire (SOS) is a hetero epitaxialprocess for integrated circuitmanufacturing that consists of a thin layer (typically thinner than 0. 6 micrometres) of silicongrown on a sapphire (Al2O3) wafer. SOS is part of the Silicon on Insulator (SOI) family of CMOS technologies. SOS is primarily used in aerospace and militaryapplications because of its inherent resistance to radiation. U. S. Dept. of Commerce requires End User Certificate for