Semiconductor devices. Mechanical and climatic test methods - Latch-up test Ingestion-build-61878 including DSEAR

including DSEAR

mobile networks

Determination of thickness and flatness

subcontractors and students

Diagrams and tables have been provided in BS EN 3690 to further illustrate these points

Semiconductor devices. Mechanical and climatic test methods - Latch-up test Ingestion-build-61878 including DSEAR1 Scope and object This part of IEC 60749 covers the I test and the overvoltage latch up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to establish a method for determining integrated circuit (IC) latch up characteristics and to define latch up failure criteria. Latch up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress"