Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore The sampling procedures and the

The sampling procedures and the methods of test for verification of conformity to the requirements of this standard are also specified

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This International Standard is applicable to as-received (field-moist) samples and specifies two different procedures for the liberation of cyanide from the soil:

Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore The sampling procedures and the1 Scope This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin lead (SnPb) or lead free (Pb free) solder for the attachment. This test method provides a procedure for dip and look solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability